NEXIV VMZ-H3030
基本介紹: Achieves measurement at the highest precision of the NEXIV series, as well as advanced usability and performance. 24小(xiǎo)時谘詢熱線:Achieves measurement at the highest precision of the NEXIV series, as well as advanced usability and performance. VMZ-H3030 incorporates the features of the up-to-date technologies of the Nikon VMZ-R series to achieve high accuracy and throughput with excellent ease of use. Suitable for applications requiring strict quality control through highly precise measurement.


| Zooming head | Optical magnification | Applications | 
|---|---|---|
| Type 1 | 0.5X – 7.5X | Molds, mechanical parts (household, automobiles), PCB, electronic parts, ceramic parts | 
| Type 2 | 1X – 15X | |
| Type 3 | 2X – 30X | Electronic parts | 
| Type 4 | 4X – 60X | High density package substrate (line width, height) | 
| Type TZ | 1X – 120X | Wafer pattern (WLP, bump height, rewiring mask, MEMS mask) | 
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